Materials, processing and reliability of low temperature bonding in 3D chip stacking-Reference-Cited by-同舟云学术

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Materials, processing and reliability of low temperature bonding in 3D chip stacking

Published:2018-06 Issue: Volume:750 Page:980-995
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Zhang Liang,Liu Zhi-quan,Chen Sinn-Wen,Wang Yao-dong,Long Wei-Min,Guo Yong-huan,Wang Song-quan,Ye Guo,Liu Wen-yi

Funder

Natural Science Foundation of China

China Postdoctoral Science Foundation

International Cooperation

Major State Research Development Program of China

Doctor Talent Project of Jiangsu Normal University

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference146 articles.

1. Low-temperature and low-pressure Cu-Cu bonding buy highly sinterable Cu nanoparticle paste;Li;Nanoscale Res. Lett.,2017

2. Transition from flip chip solder joint to 3D IC microbump: its effect on microstructure anisotropy;Tu;Microelectron. Reliab.,2013

3. Reliability challenges in 3D IC packaging technology;Tu;Microelectron. Reliab.,2011

4. Materials challenges in three-dimensional integrated circuits;Chen;MRS Bull.,2015

5. Metallurgical challenges in microelectronic 3C IC packaging technology for future consumer electronic products;Tu;Sci. China (Technol. Sci.),2013

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