A Modular Solder System with Hierarchical Morphology and Backward Compatibility-Reference-Cited by-同舟云学术

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A Modular Solder System with Hierarchical Morphology and Backward Compatibility

Published:2018-07-18 Issue:33 Volume:14 Page:1801349
ISSN:1613-6810
Container-title:Small
language:en
Short-container-title:Small

Author:

Lee Han Bit¹,Kim Young Won¹,Kim Sang Hoon¹^ORCID,Park Suk Hee¹,Choi Joon-Phil²,Aranas Clodualdo³

Affiliation:

1. Digital Manufacturing Process Group; Korea Institute of Industrial Technology; 113-58 Seohaean-ro Siheung-si Gyeonggi-do 15014 Republic of Korea

2. Department of Mining and Materials Engineering; McGill University; 3610 University Street Montreal Quebec H3A 0C5 Canada

3. CanmetMATERIALS; Natural Resources Canada; 183 Longwood Road South Hamilton Ontario L8P 0A5 Canada

Funder

Ministry of Science, ICT and Future Planning

National Research Council of Science and Technology

Korea Institute of Industrial Technology

Publisher

Wiley

Subject

Biomaterials,Biotechnology,General Materials Science,General Chemistry

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/smll.201801349/fullpdf

Reference39 articles.

1. Low Temperature Sintering Cu6Sn5Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

2. Reflow and Electrical Characteristics of Nanoscale Solder

3. Impurity and alloying effects on interfacial reaction layers in Pb-free soldering

4. Structure and properties of lead-free solders bearing micro and nano particles

5. Oxidation resistant effects of Ag2S in Sn–Ag–Al solder: A mechanism for higher electrical conductivity and less whisker growth

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1. Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies;Journal of Materials Research and Technology;2023-07

2. The effect of Ge on the microstructure, thermal behavior, and mechanical properties of lead-free Sn-5Sb-0.7Cu solder alloy;Journal of Materials Science: Materials in Electronics;2023-01

3. Topography‐Supported Nanoarchitectonics of Hybrid Scaffold for Systematically Modulated Bone Regeneration and Remodeling;Advanced Functional Materials;2022-09-14

4. Facile synthesis of mesoporous hierarchical TiO2 micro-flowers serving as the scaffolding of 0D Ag3PO4 nanoparticles for the ultra-fast degradation of organic pollutants;Journal of Alloys and Compounds;2022-07

5. Synthesis of Bi–Pb–Sn–Cd solder particles for joining Ag-plated PZT ceramics at 100 °C;Journal of Materials Science: Materials in Electronics;2022-02-05

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