Oxidation resistant effects of Ag2S in Sn–Ag–Al solder: A mechanism for higher electrical conductivity and less whisker growth-Reference-Cited by-同舟云学术

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Oxidation resistant effects of Ag2S in Sn–Ag–Al solder: A mechanism for higher electrical conductivity and less whisker growth

Published:2016-04 Issue: Volume:105 Page:25-35
ISSN:0010-938X
Container-title:Corrosion Science
language:en
Short-container-title:Corrosion Science

Author:

Kim Sang Hoon,Hui Kwun Nam,Kim Yong-Jin,Lim Tae-Soo,Yang Dong-Yeol,Kim Ki Bong,Kim Young Ja,Yang Sangsun^ORCID

Funder

R&D Convergence Program of MSIP (Ministry of Science, ICT and Future Planning)

ISTK (Korea Research Council for Industrial Science and Technology) of Republic of Korea

Publisher

Elsevier BV

Subject

General Materials Science,General Chemical Engineering,General Chemistry

Reference35 articles.

1. Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics;Medgyes;Corros. Sci.,2015

2. Creep corrosion cracking of Sn-3.0Ag and Sn-0.5Cu solder alloys in NaCl solution;Yokoyama;Corros. Sci.,2014

3. In situ observations on creep fatigue fracture behavior of Sn–4Ag/Cu solder joints;Zhang;Acta Mater.,2011

4. Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders;Jiang;Chem. Mater.,2007

5. Development of Sn–Zn lead-free solders bearing alloying elements;Zhang;J. Mater. Sci.: Mater. Electron.,2010

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