Synthesis and Thermal and Wetting Properties of Tin/Silver Alloy Nanoparticles for Low Melting Point Lead-Free Solders-Reference-Cited by-同舟云学术

Synthesis and Thermal and Wetting Properties of Tin/Silver Alloy Nanoparticles for Low Melting Point Lead-Free Solders

Published:2007-08-11 Issue:18 Volume:19 Page:4482-4485
ISSN:0897-4756
Container-title:Chemistry of Materials
language:en
Short-container-title:Chem. Mater.

Author:

Jiang Hongjin¹,Moon Kyoung-sik¹,Hua Fay¹,Wong C. P.¹

Affiliation:

1. School of Materials Science and Engineering and School of Chemistry and Biochemistry, Georgia Institute of Technology, Atlanta, Georgia 30332, and Materials Technology Operation, Intel Corporation, 3065 Bowers Avenue, Santa Clara, California 95054

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/cm0709976

Reference19 articles.

1. Evaluation of Lead- Free Solder Joints in Electronic Assemblies

2. Size-Dependent Melting Properties of Small Tin Particles: Nanocalorimetric Measurements

3. Melting of Isolated Tin Nanoparticles

4. Comment on “Melting of Isolated Tin Nanoparticles”

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