Preparation and characterization of nano-solder paste with high nanoparticle loading and their thermal and printing properties-Reference-Cited by-同舟云学术

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Preparation and characterization of nano-solder paste with high nanoparticle loading and their thermal and printing properties

Published:2023-03 Issue: Volume:297 Page:127399
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Wernicki Evan^ORCID,Shu Yang,Fratto Edward,Gao Fan,Morose Gregory^ORCID,Lucas Brendan^ORCID,Yang Zhengyang^ORCID,Gu Zhiyong^ORCID

Funder

National Science Foundation

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference62 articles.

1. Solder Joint Technology: Materials, Properties, and Reliability;Tu,2007

2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology;Zeng;Mater. Sci. Eng. R Rep.,2002

3. Interfacial reactions between lead-free solders and common base materials;Laurila;Mater. Sci. Eng. R Rep.,2005

4. Microstructure evolution of tin-lead solder;Ubachs;IEEE Trans. Compon. Packag. Technol.,2004

5. Electronic waste recycling act of 2003: California's response to the electronic waste crisis;Bergner;Marquette Law Rev.,2004

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of the Possibilities of Creating Embedded Vias’ Based on Different Solder Alloys;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

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