Interfacial reactions between lead-free solders and common base materials
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference128 articles.
1. Reliability aspects of lead-free solders in electronic assemblies;Viswanadham,2004
2. Pb-free solders for flip-chip interconnects
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4. Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper
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