1. N.C. Lee, “Pb-free Soldering—Where the World is Going,” Advancing Microelectronics (Sept./Oct. 1999), p. 29.
2. A. Grusd, “Integrity of Solder Joints from Pb-Free Solder Paste,” Proc. NEPCON West’99 (Norwalk, CT: Reed Exhibition Companies, 1999).
3. J. Glazer, “Metallurgy of Low Temperature Pb-Free Solder for Electronic Assembly,” Int. Mater. Reviews, 40 (2) (1995), pp. 65–93.
4. J. Glazer, “Microstructure and Mechanical Properties of Pb-Free Solder Alloys for Low-Cost Electronic Assembly: A Review,” J. Electron. Mater., 23 (8) (1994), pp. 693–700.
5. G. Whitten, “Pbe-free Solder Implementation for Automotive Electronics,” Proc. 50th Electron. Comp. Tech. Conf. (Piscatawny, NJ: IEEE Publications, 2000), pp. 1410–1415.