Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics-Reference-Cited by-同舟云学术

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Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics

Published:2015-03 Issue: Volume:92 Page:43-47
ISSN:0010-938X
Container-title:Corrosion Science
language:en
Short-container-title:Corrosion Science

Author:

Medgyes Bálint,Horváth Barbara,Illés Balázs,Shinohara Tadashi,Tahara Akira,Harsányi Gábor,Krammer Olivér

Publisher

Elsevier BV

Subject

General Materials Science,General Chemical Engineering,General Chemistry

Reference39 articles.

1. Directive of the European Commission for the Reduction of Hazardous Substances, (RoHS) 2002/95/EC.

2. Creep corrosion cracking of Sn–3.0Ag and Sn–0.5Cu solder alloys in NaCl solution

3. Corrosion mechanism of Al, Al–Zn and Al–Zn–Sn alloys in 3 wt.% NaCl solution

4. New Pb‐free solder alloy with superior mechanical properties

5. Electrochemical corrosion behaviour of Pb-free Sn–8.5Zn–0.05Al–XGa and Sn–3Ag–0.5Cu alloys in chloride containing aqueous solution

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4. In situ study the effects of bias and electric field intensity on electrochemical migration behavior of Sn96.5Ag3.0Cu0.5 solder alloy;Journal of Materials Research and Technology;2023-11

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