Compatibility study of no-clean flux residue and conformal coatings using two electrode electrochemical impedance method-Reference-Cited by-同舟云学术

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Compatibility study of no-clean flux residue and conformal coatings using two electrode electrochemical impedance method

Published:2024-08 Issue: Volume:159 Page:115452
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Li Feng^ORCID,Verdingovas Vadimas,Mantis Ioannis,Jellesen Morten Stendahl,Ambat Rajan

Publisher

Elsevier BV

Reference62 articles.

1. Development of micro assembly processes for further miniaturization in electronics production

2. IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A;Bird,1995

3. In 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC);Ambat,2016

4. 2009 Annual Reliability and Maintainability Symposium;Hansen,2009

5. Corrosion in Electronics at Device Level

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