Evaluating electrochemical migration behavior of sintered nano-Ag: factors of bias voltage, electrode spacing, sinter process parameters, and NaCl concentration-Reference-Cited by-同舟云学术

Evaluating electrochemical migration behavior of sintered nano-Ag: factors of bias voltage, electrode spacing, sinter process parameters, and NaCl concentration

Published:2023-10 Issue:28 Volume:34 Page:
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Xu Yongzhe,Liu Yang^ORCID,Pan Zhen,Li Ke,Lu Jicun,Sun Quan

Funder

Key Research and Development Program of Heilongjiang

National Natural Science Foundation of China

National Key Research and Development Program of China

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s10854-023-11369-8.pdf

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4. R. Kawabata, T. Matsuda, R. Seo, A. Hirose, Metallization-free silver sinter bonding to silicon via in situ decomposition of silver oxalate. Mater. Lett. 300, 9 (2021)

5. S.Y. Zhang, Q. Wang, T.S. Lin, Cu–Cu joining using citrate coated ultra-small nano-silver pastes. J. Manuf. Process. 62, 546 (2021)