Influence of Pt addition on corrosion resistance of Sn-9Zn-0.02Al-xPt solder alloys
Author:
Funder
Fundamental Research Funds for the Central Universities
University of Science and Technology Beijing
National Natural Science Foundation of China
Publisher
Elsevier BV
Reference57 articles.
1. Magnetron sputtering preparation of Cu6Sn5 preferred-orientation coating and its influence on wettability of Sn-based lead-free solder;Zhang;Surf. Coat. Technol.,2022
2. Corrosion behavior of Sn-3.0Ag-0.5Cu alloy under chlorine-containing thin electrolyte layers;Liao;Corros. Sci.,2018
3. Metastable pitting and its correlation with electronic properties of passive films on Sn–xZn solder alloys;Liu;Corros. Sci.,2015
4. Study on the effects of Ag addition on the mechanical properties and oxidation resistance of Sn–Zn lead-free solder alloy by high-throughput method;Li;J. Mater. Sci. Mater. Electron.,2023
5. Electrochemical corrosion behaviour of Sn-Zn-xBi alloys used for miniature detonating cords;Liu;J. Mater. Sci. Technol.,2019
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