Funder
National Key R&D Program of China
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Au-(In-Bi) and Ag-(In-Bi) Metallic Bonding for Temperature Sensitive Materials;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13