Fine Microstructured In–Sn–Bi Solder for Adhesion on a Flexible PET Substrate: Its Effect on Superplasticity and Toughness-Reference-Cited by-同舟云学术

Fine Microstructured In–Sn–Bi Solder for Adhesion on a Flexible PET Substrate: Its Effect on Superplasticity and Toughness

Published:2019-04-25 Issue:18 Volume:11 Page:17090-17099
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Kim Sang Hoon¹^ORCID,Yeon Si-Mo¹,Kim Jin Hak¹,Park Seong Je¹,Lee Ji Eun¹,Park Suk-Hee¹^ORCID,Choi Joon-Phil²,Aranas Clodualdo³,Son Yong¹

Affiliation:

1. Digital Manufacturing Process Group, Korea Institute of Industrial Technology, 113-58 Seohaean-ro, Siheung-si, Gyeonggi-do 15014, Republic of Korea

2. Department of Mining and Materials Engineering, McGill University, 3610 University Street, Montreal, Quebec H3A 0C5, Canada

3. Mechanical Engineering, University of New Brunswick, 15 Dineen Drive, Fredericton, New Brunswick E3B 5A3, Canada

Funder

Ministry of Science, ICT and Future Planning

Korea Institute of Industrial Technology

National Research Council of Science and Technology

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.9b04159

Reference48 articles.

1. A Modular Solder System with Hierarchical Morphology and Backward Compatibility

2. Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

3. Magnetic nanoparticle-based solder composites for electronic packaging applications

4. Low-temperature-solderable intermetallic nanoparticles for 3D printable flexible electronics

5. Tailoring Fast Directional Mass Transport of Nano-Confined Ag–Cu Alloys upon Heating: Effect of the AlN Barrier Thickness

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of ZnO nanoparticle addition on the wettability, microstructure and mechanical properties of In-45.6Sn-5Bi low temperature solder;Journal of Materials Science;2024-08

2. Composition design, microstructure and mechanical properties of bismuth-doped In–Sn-based low-temperature solder alloy;Journal of Materials Science: Materials in Electronics;2024-07

3. An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles;Journal of Materials Research and Technology;2024-05

4. The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt%Sn/Cu solder joint;Materials Science and Engineering: A;2023-08

5. The effect of Ge on the microstructure, thermal behavior, and mechanical properties of lead-free Sn-5Sb-0.7Cu solder alloy;Journal of Materials Science: Materials in Electronics;2023-01