Effect of ZnO nanoparticle addition on the wettability, microstructure and mechanical properties of In-45.6Sn-5Bi low temperature solder
Author:
Funder
National Key R&D Program of China
National Natural Science Foundation of China and the China Academy of Engineering Physics
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10853-024-10038-3.pdf
Reference42 articles.
1. Nguyen VL, Kim SH, Jeong JW, Lim TS, Yang DY, Kim KB, Kim YJ, Lee JH, Kim YJ, Yang S (2017) Microstructure and mechanical behavior of low-melting point Bi-Sn-In solder joints. Electron Mater Lett 13(5):420–426. https://doi.org/10.1007/s13391-017-1614-1
2. Zhong Y, An R, Ma H, Wang C (2019) Low-temperature-solderable intermetallic nanoparticles for 3D printable flexible electronics. Acta Mater 162:163–175. https://doi.org/10.1016/j.actamat.2018.09.069
3. Kim SH, Park MS, Choi JP, Aranas C (2017) Improved electrical and thermo-mechanical properties of a MWCNT/In-Sn-Bi composite solder reflowing on a flexible PET substrate. Sci Rep 7(1):13756. https://doi.org/10.1038/s41598-017-14263-6
4. Aasmundtveit KE, Eggen T, Manh T, Nguyen HV (2018) In–Bi low-temperature SLID bonding for piezoelectric materials. Solder Surf Mt Technol 30(2):100–105. https://doi.org/10.1108/SSMT-10-2017-0034
5. Park JH, Park JC, Shin S, Paik KW (2019) Low-temperature bonding of PZT (PbZrTiO3) and flexible printed circuits using Sn52In solder anisotropic conductive films for flexible ultrasonic transducers. IEEE Trans Compon Pack Manuf Technol 9(11):2152–2159. https://doi.org/10.1109/TCPMT.2019.2945016
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