Publisher
Springer Science and Business Media LLC
Reference46 articles.
1. Gates, B. D. Materials science. Flexible electronics. Science 323, 1566–1567 (2009).
2. Kim, S. H. et al. Thermo-mechanical evolution of ternary Bi–Sn–In solder micropowders and nanoparticles reflowed on a flexible PET substrate. Appl. Surf. Sci. 415, 28–34 (2017).
3. Zhang, L. & Tu, K. Structure and properties of lead-free solders bearing micro and nano particles. Materials Science and Engineering: R: Reports 82, 1–32 (2014).
4. Gao, M., Li, L. & Song, Y. Inkjet printing wearable electronic devices. Journal of Materials Chemistry C 5, 2971–2993 (2017).
5. Li, M. Y., Yang, H. F., Zhang, Z. H., Gu, J. H. & Yang, S. H. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention. Scientific Reports 6, 27522 (2016).
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