Thermo-mechanical evolution of ternary Bi–Sn–In solder micropowders and nanoparticles reflowed on a flexible PET substrate-Reference-Cited by-同舟云学术

Thermo-mechanical evolution of ternary Bi–Sn–In solder micropowders and nanoparticles reflowed on a flexible PET substrate

Published:2017-09 Issue: Volume:415 Page:28-34
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Kim Sang Hoon,Yang Dong-Yeol,Kim Yong-Jin,Min Taesik,Choi Joonphil,Yun Jaecheol,Nguyen Van Luong,Kim Ki Bong,Kim Young Ja,Lee Jun Hong,Kim Yang Do,Yang Sangsun

Funder

National Research Council of Science & Technology

Korea government

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference29 articles.

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2. Performance of flexible capacitors based on polypyrrole/carbon fiber electrochemically prepared from various phosphate electrolytes;Yuan;Appl. Surf. Sci.,2016

3. Preparation of property-controlled Bi-based solder powders by a ball-milling process;Kim;Metals,2016

4. Solder wetting behavior enhancement via laser-textured surface microcosmic topography;Chen;Appl. Surf. Sci.,2016

5. In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process;Qu;Appl. Surf. Sci.,2014

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