The microstructure, melting properties and wettability of Sn–3.5Ag–0.7Cu–xIn lead-free solder alloys
Author:
Affiliation:
1. School of Materials Science and Engineering, Southwest University of Science and Technology, Mianyang, People’s Republic of China
Funder
Scientific Research Fund of Sichuan Provincial Education Department
SWUST
Publisher
Informa UK Limited
Subject
Condensed Matter Physics
Link
https://www.tandfonline.com/doi/pdf/10.1080/14786435.2021.1991597
Reference40 articles.
1. Effects of Ge on Microstructure, Spreadability, and Mechanical Properties of the Sn-32Pb-18Cd Solder Alloy
2. Behavior of Sn-0.7Cu-xZn lead free solder on physical properties and micro structure
3. Thermomechanical reliability of a Cu/Sn-3.5Ag solder joint with a Ni insertion layer in flip chip bonding for 3D interconnection
4. Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples
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1. Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy;Soldering & Surface Mount Technology;2024-08-06
2. Effect of individual and synergistic alloying of In and Ni on microstructure, phase stability and thermal properties of lead-free Sn-0.7Cu solder;Philosophical Magazine;2024-07-29
3. Effects of In addition on the properties of Sn–4Ag–0.5Cu–3Bi–0.05Ni solder;Journal of Materials Science: Materials in Electronics;2024-07
4. Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints;Electronics;2023-04-18
5. Real-time monitoring of soldering process in SAC composite solder paste: movement and interaction of dopant particles in solder paste;Journal of Materials Science: Materials in Electronics;2023-02
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