Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference211 articles.
1. The Chemical Modeling of Electronic Materials and Interconnections
2. Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions
3. Interfacial reaction issues for lead-free electronic solders
4. Effect of La on the Cu–Sn intermetallic compound (IMC) growth and solder joint reliability
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