Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions-Reference-Cited by-同舟云学术

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Published:2015-06-20 Issue:3 Volume:16 Page:033505
ISSN:1468-6996
Container-title:Science and Technology of Advanced Materials
language:en
Short-container-title:Science and Technology of Advanced Materials

Author:

Ting Tan Ai,Wen Tan Ai,Yusof Farazila

Funder

Postgraduate Research Fund by University of Malaya

High Impact Research by Ministry of Higher Education, Malaysia

Publisher

Informa UK Limited

Subject

General Materials Science

Link

http://www.tandfonline.com/doi/pdf/10.1088/1468-6996/16/3/033505

Reference127 articles.

1. Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

2. Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

3. Kinetics of intermetallic phase formation at the interface of Sn–Ag–Cu–X (X=Bi, In) solders with Cu substrate

4. Interfacial reactions between Sn–8Zn–3Bi–xAg lead-free solders and Cu substrate

5. Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates

Cited by 64 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Nano-scale mechanistic model for microstructural reliability in reactive hybrid solder joints;Materials Characterization;2024-10

2. Tin Multilayer‐Aided SAC305‐Based Lead‐Free Solder Joint Interface with Cu: An Investigation of the Stress Distribution by Finite Element Analysis and Nanoindentation Studies;Advanced Engineering Materials;2024-09-08

3. Cu array fabrication: An environmentally sustainable approach through bicontinuous microemulsion differential electrodeposition for advanced power device packaging;Journal of the Taiwan Institute of Chemical Engineers;2024-09

4. Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability;IEEE Transactions on Power Electronics;2024-09

5. Effects of TiC nanoparticle addition on microstructures and mechanical properties of Sn-58Bi solder joints;Materials Today Communications;2024-08