Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference27 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
3. Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package
4. Transient fracturing of solder joints subjected to displacement-controlled impact loads
5. Shear strength and interfacial microstructure of Sn–Ag–xNi/Cu single shear lap solder joints
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1. Effects of Minor Zn Dopants in Sn-10Bi Solder on Interfacial Reaction and Shear Properties of Solder on Ni/Au Surface Finish;Materials;2024-09-03
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4. Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys;Journal of Electronic Materials;2023-12-15
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