Shear strength and interfacial microstructure of Sn–Ag–xNi/Cu single shear lap solder joints
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference30 articles.
1. Physics and materials challenges for lead-free solders
2. Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging
3. Effects ofin situnickel particle addition on the microstructure and microhardness of Sn–Ag solder
4. Adhesive strength and tensile fracture of Ni particle enhanced Sn–Ag composite solder joints
5. Mechanical strength of Sn-3.5Ag-based solders and related bondings
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1. Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint;Journal of Materials Science: Materials in Electronics;2024-01
2. Mechanical properties degradation of Sn 37Pb solder joints caused by interfacial microstructure evolution under cryogenic temperature storage;Materials Characterization;2023-07
3. Fabrication of 30 µm Sn Microbumps by Electroplating and Investigation of IMC Characteristics on Shear Strength;Electronics;2022-12-28
4. Structure and properties of low-Ag SAC solders for electronic packaging;Journal of Materials Science: Materials in Electronics;2022-09-24
5. Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish;Journal of Materials Science: Materials in Electronics;2022-03-07
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