Physics and materials challenges for lead-free solders
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1517165
Reference66 articles.
1. Tin–lead (SnPb) solder reaction in flip chip technology
2. Morphology of instability of the wetting tips of eutectic SnBi, eutectic SnPb, and pure Sn on Cu
3. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
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