Formation mechanism for the interface between Cu and Sn formed by magnetic pulse welding-Reference-Cited by-同舟云学术

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Formation mechanism for the interface between Cu and Sn formed by magnetic pulse welding

Published:2024-02 Issue: Volume:208 Page:113609
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Zhang Hehe,Tan Tiantian,Yang Man,Guo Chunjiang,Yin Limeng,Zhang Long,Chai Sensen

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference29 articles.

1. Physics and materials challenges for lead-free solders;Tu;J. Appl. Phys.,2003

2. Effect of nanoparticles addition on the microstructure and properties of lead-free solders: a review;Zhang;Appl. Sci.-Basel,2019

3. Microstructure and properties of SiC whisker reinforced Sn-0.3Ag-0.7Cu solder alloy;Zhang;JOM,2023

4. The role of eutectic colonies in the tensile properties of a Sn-Zn eutectic solder alloy;Ramos;Mat. Sci. Eng. A-Struct.,2020

5. Improved microstructure and mechanical properties for Sn58Bi0.7Zn solder joint by addition of graphene nanosheets;Ma;J. Alloys Compd.,2016

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Sealing performance and joining mechanism of magnetic pulse welded joints on 3003 AI prismatic cell container for battery applications;Archives of Civil and Mechanical Engineering;2024-09-03

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