Improved microstructure and mechanical properties for Sn58Bi0.7Zn solder joint by addition of graphene nanosheets
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference31 articles.
1. Low temperature bonding for high temperature applications by using SnBi solders;Yang;J. Alloys Compd.,2015
2. Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints;Goh;J. Mater. Sci.,2015
3. Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder;Chen;J. Alloys Compd.,2015
4. Mechanical property of the epoxy-contained Sn–58Bi solder with OSP surface finish;Myung;J. Alloys Compd.,2014
5. Effect of nanosized graphite on properties of Sn–Bi solder;Yang;J. Mater. Sci. Mater. Electron,2013
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