Effect of Si3N4 nanoparticles on IMC as well as mechanical properties of Sn58Bi/Cu solder joints during thermal aging-Reference-Cited by-同舟云学术

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Effect of Si3N4 nanoparticles on IMC as well as mechanical properties of Sn58Bi/Cu solder joints during thermal aging

Published:2024-05 Issue: Volume:30 Page:9140-9147
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Deng Kai,Zhang Liang^ORCID,Chen Mo,Huang Peipei

Publisher

Elsevier BV

Reference21 articles.

1. Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology;Tu;Mater Sci Eng R Rep,2019

2. Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints by using thermal gradient bonding;Zhang;Mater Char,2023

3. Reliability issues of lead-free solder joints in electronic devices;Jiang;Sci Technol Adv Mater,2019

4. Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints;Zhang;J Mater Sci Mater Electron,2015

5. A novel bio-based composite phase change material with excellent photo-thermal conversion capability for solar energy harvesting and energy storage;Zhu;J Energy Storage,2024

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