Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference55 articles.
1. Materials challenges in three-dimensional integrated circuits
2. Tin–lead (SnPb) solder reaction in flip chip technology
3. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
4. Recent research advances in Pb-free solders
5. Reliability challenges in 3D IC packaging technology
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