Author:
Ho Ching Yuan,Chou Hao Wei,Chi Hsiang Yuan,Liao Geng Huai
Funder
National Cheng Kung University
Reference33 articles.
1. Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology;Tu;Mater. Sci. Eng. R.,2019
2. Design and reliability assessment of novel 3D-IC packaging;Su;J. Mech.,2017
3. Overview and outlook of three-dimensional integrated circuit packaging, three imensional Si integration, and three-dimensional integrated circuit integration;Lau;J. Electron. Packag.,2014
4. Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications;Yang;in: Proceedings of the IEEE Sixty Fourth Electronic Components and Technology Conference (ECTC),2014
5. Thermal cycling test and simulation of fan-out chip-last panel-level packaging for heterogeneous integration;Lau;J. Microelectron. Electron. Packag.,2021
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