Effect of Sn Orientation on Electromigration Failure in CuSn Solders
Author:
Funder
Semiconductor Research Corporation
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s11664-024-11301-8.pdf
Reference33 articles.
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3. Cai, X., A.M. Pham, and M. Koslowski. 2021. Mechanical failure of Cu-Sn solder joints. J. Electron. Mater. 50(10): 6006–6013.
4. Lin, Y.H., Y.C. Hu, C.M. Tsai, C.R. Kao, and K.N. Tu. 2005. In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing. Acta Mater. 53(7): 2029–2035.
5. Nah, J.-W., K. Chen, K.N. Tu, B.-R. Su and C. Chen. 2007. Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization. J. Mater. Res. 22(3): 763–769.
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