Author:
Yang Chaoran,Le Fuliang,Lee S.W. Ricky
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. Interfacial reactions between lead-free solders and common base materials;Laurila;Mater. Sci. Eng. R. Rep.,2005
2. Interfacial reaction issues for lead-free electronic solders;Ho,2007
3. Ductile-to-brittle transition strain rate;Darveaux,2006
4. Mechanical property evaluation of Sn–3.0Ag–0.5Cu BGA solder joints using high-speed ball shear test;Ha;J. Electron. Mater.,2009
5. BGA brittle fracture—alternative solder joint integrity test methods;Newman,2005
Cited by
30 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献