In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
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4. Current-crowding-induced electromigration failure in flip chip solder joints
5. Proceedings of the 2002 Electronic Components and Technology Conference;Wu,2002
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