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Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

  • Published:2006-01 Issue:1-3 Volume:51 Page:1-35
  • ISSN:0927-796X
  • Container-title:Materials Science and Engineering: R: Reports
  • language:en
  • Short-container-title:Materials Science and Engineering: R: Reports

Author:

Li Yi,Wong C.P.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference141 articles.

1. Handbook of Lead-free Solder Technology for Microelectronic Assemblies;Vianco,2004

2. Lead-free Solders in Microelectronics

3. Fundamentals of Microsystems Packaging,2001

4. RoHS Regulations (UK) Government Guidance Notes, August 2005.

5. Green IC packaging;Cannis;Adv. Packag.,2001

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