Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints-Reference-Cited by-同舟云学术

Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

Published:1998-08 Issue:1-2 Volume:55 Page:5-13
ISSN:0921-5107
Container-title:Materials Science and Engineering: B
language:en
Short-container-title:Materials Science and Engineering: B

Author:

Chan Y.C,So Alex C.K,Lai J.K.L

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference25 articles.

1. Reliability studies of surface mount solder joints—effect of Cu–Sn intermetallic compounds;So;IEEE Trans. CPMT-B,1996

2. Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints;Tu;IEEE Trans. CPMT-B,1997

3. Y.C. Chan, P.L. Tu, Alex C.K. So, J.K.L. Lai, Effect of intermetallic compounds on the shear fatigue of Cu/63Sn–37Pb solder joints, IEEE Trans. CPMT-B, Nov. 1997 (to be published).

4. Y.C. Chan, J.K.L. Lai, Alex C.K. So, Y. Tian, P.L. Tu, Reliability of Surface Mount Solder Joints in Microelectronic Packaging and Assembly, Proc. of 2nd. Int. Symp. on Elect. Packag. Technol., Dec. 1996, pp. 484–490.

5. S.F. Dirnfeld, J.J. Ramon, Microstructure investigation of copper–tin intermetallics and the influence of layer thickness on shear strength, suppl. to Weld. J., Oct 1990, 373–377s.

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