Effects of solder thickness on interface behavior and nanoindentation characteristics in Cu/Sn/Cu microbumps
Author:
Funder
Young Scientists Fund
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Link
https://link.springer.com/content/pdf/10.1007/s40194-022-01261-0.pdf
Reference41 articles.
1. Panchenko I, Wolter KJ, Croes K et al (2019) Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking. Microelectron Reliab 102:113296
2. Yang MY, Chen JS, Yang J et al (2020) Interfacial transfer and phase evolution between Cu and Sn solder doped with minor Cu, Ag and Ni: experimental and theoretical investigations. Appl Phys A 126:652
3. Agarwal R, Zhang W, Limaye P et al (2010) Cu/Sn microbumps interconnect for 3D TSV chip stacking. IEEE:858–863
4. Wang JN, Chen JS, Zhang ZY et al (2021) Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints. Solder Surf Mt Tech. https://doi.org/10.1108/SSMT-08-2021-0053
5. Li JF, Agyakwa PA, Johnson CM (2011) Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process. Acta Mater 59:1198–1211
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