Cu array fabrication: An environmentally sustainable approach through bicontinuous microemulsion differential electrodeposition for advanced power device packaging-Reference-Cited by-同舟云学术

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Cu array fabrication: An environmentally sustainable approach through bicontinuous microemulsion differential electrodeposition for advanced power device packaging

Published:2024-09 Issue: Volume:162 Page:105584
ISSN:1876-1070
Container-title:Journal of the Taiwan Institute of Chemical Engineers
language:en
Short-container-title:Journal of the Taiwan Institute of Chemical Engineers

Author:

Wang Fengyi,Li Xiangji,Liu Jiahao^ORCID,Wang Jianqiang,Zhang Jinghui,Chen Hongtao^ORCID

Publisher

Elsevier BV

Reference50 articles.

1. A brief overview of the rapid progress and proposed improvements in gallium nitride epitaxy and process for third-generation semiconductors with wide bandgap;Liu;Micromachines,2023

2. Design strategies of high-performance lead-free electroceramics for energy storage applications;Guo;Rare Met,2024

3. A novel antioxidant and low-temperature Sn-Zn solder paste based on Zn@Sn core-shell structure;Mater Today Commun,2022

4. Die-attach bonding at 230°C using micron Sn-coated Zn particles for high-temperature applications;Wang;J Mater Res Technol,2022

5. Microstructure changes in Sn-Bi solder joints reinforced with Zn@Sn particles in thermal cycling and thermomigration;Wang;J Taiwan Inst Chem Eng.,2023

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