Kinetics of intermetallic phase formation at the interface of Sn–Ag–Cu–X (X=Bi, In) solders with Cu substrate
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference30 articles.
1. Advances in lead-free electronics soldering
2. Tin-silver-copper eutectic temperature and composition
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