Interfacial reactions between Sn–8Zn–3Bi–xAg lead-free solders and Cu substrate
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference22 articles.
1. Lead-free Solders in Microelectronics
2. Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer
3. In search of new lead-free electronic solders
4. Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys
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1. Recent Low Temperature Solder of SnBi and Its Bonding Characteristics;Journal of Welding and Joining;2020-12-30
2. Review of microstructure and properties of low temperature lead-free solder in electronic packaging;Science and Technology of Advanced Materials;2020-01-31
3. Pb-free solder—microstructural, material reliability, and failure relationships;Handbook of Materials Failure Analysis;2020
4. On the mechanism of Sn tunnelling induced intermetallic formation between Sn-8Zn-3Bi solder alloys and Cu substrates;Journal of Alloys and Compounds;2019-06
5. Silver effect on the intermetallic growth in the Sn-8Zn-3Bi lead-free solder;Materials Today: Proceedings;2018
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