Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference43 articles.
1. iNEMI Pb-free alloy alternatives project report: state of the industry;Henshall,2008
2. Lead-free Solder Interconnect Reliability;Shangguan,2005
3. A review of mechanical properties of lead-free solders for electronic packaging;Ma;J. Mater. Sci.,2009
4. The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor;Coyle,2009
5. A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products;Shnawah;Microelectron. Reliab.,2012
Cited by
26 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献