Microstructure changes in Sn-Bi solder joints reinforced with Zn@Sn particles in thermal cycling and thermomigration
Author:
Publisher
Elsevier BV
Subject
General Chemical Engineering,General Chemistry
Reference33 articles.
1. Thermomigration suppression in Sn3.5Ag solder joints by hot-end FeCoNiMn alloy;Shen;Intermetallics,2023
2. Extremely thin interlayer of multi-element intermetallic compound between Sn-based solders and FeCoNiMn high-entropy alloy;Shen;Appl Surf Sci,2021
3. Solderable conductive paste for electronic textiles;Wu;J Taiwan Inst Chem Eng,2023
4. Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding;Jhan;J Taiwan Inst Chem Eng,2022
5. Impact of microstructure evolution on the long-term reliability of wafer-level chip-scale package Sn–Ag–Cu solder interconnects;Lee;IEEE Trans Comp, Packag Manuf Technol,2020
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1. BME-Assisted Fabrication of Porous Copper Films with Adjustable Porosity and Ligament Width for Microelectronic Interconnects;Journal of Physics: Conference Series;2024-01-01
2. Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing;Journal of Electronic Materials;2023-12-12
3. Soft-template-assisted bottom-up fabrication of tunable porosity monolithic copper film for interconnection in microelectronics;Journal of the Taiwan Institute of Chemical Engineers;2023-11
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