Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding
Author:
Publisher
Elsevier BV
Subject
General Chemical Engineering,General Chemistry
Reference31 articles.
1. Three-dimensional integrated circuits;Topol;IBM J Res Dev,2006
2. Three-dimensional integrated circuits and the future of system-on-chip designs;Patti;Proc IEEE,2006
3. Transition from flip chip solder joint to 3D IC microbump: its effect on microstructure anisotropy;Tu;Microelectron Reliab,2013
4. Three-dimensional integrated circuit (3D IC) key technology: through-silicon via (TSV);Shen;Nanoscale Res Lett,2017
5. Cu to Cu direct bonding at low temperature with high density defect in electrodeposited Cu;Han;Appl Surf Sci,2021
Cited by 25 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Enhanced thermal expansion with nanocrystalline Cu in SiO2 vias for hybrid bonding;Applied Surface Science;2024-11
2. Roles and influencing mechanisms of Fe2+ and Lix984 in copper electrodeposition;Ionics;2024-09-03
3. Low temperature Cu–Cu direct bonding in air ambient by ultrafast surface grain growth;Royal Society Open Science;2024-09
4. Molecular dynamics simulation study of Zr interposer promoting Cu-Cu low-temperature hybrid bonding;Materials Today Communications;2024-08
5. Stacking Fault and Plastic Deformation Mechanism in Nano‐twinned Cu Pillar under Ultrahigh Stress;Advanced Engineering Materials;2024-07-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3