Thermomigration suppression in Sn3.5Ag solder joints by hot-end FeCoNiMn alloy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference40 articles.
1. Thermomigration and electromigration in Sn58Bi solder joints;Gu;J. Appl. Phys.,2009
2. Thermomigration in solder joints;Chen;Mater. Sci. Eng. R Rep.,2012
3. Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints;Wang;Mater. Char.,2020
4. Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: experimental and theoretical investigations;Bi;Mater. Sci. Eng.,2020
5. Influences of mono-Ni(P) and dual-Cu/Ni(P) plating on the interfacial microstructure evolution of solder joints;Zhang;Metall. Mater. Trans. A,2018
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2. Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing;Journal of Electronic Materials;2023-12-12
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