Silver effect on the intermetallic growth in the Sn-8Zn-3Bi lead-free solder-Reference-Cited by-同舟云学术

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Silver effect on the intermetallic growth in the Sn-8Zn-3Bi lead-free solder

Published:2018 Issue:9 Volume:5 Page:17553-17560
ISSN:2214-7853
Container-title:Materials Today: Proceedings
language:en
Short-container-title:Materials Today: Proceedings

Author:

Mayappan Ramani,Aishah Jasli Nor

Publisher

Elsevier BV

Subject

General Medicine

Reference27 articles.

1. Lead-Free Solder Interconnect Reliability;Shangguan,2005

2. The Mechanics of Solder Alloy Interconnects;Frear;United States of America International Thompson Publishing,1994

3. Wetting reaction versus solid state aging of eutectic SnPb on Cu

4. Solders and soldering, materials, design, production, analysis for reliable bonding;Manko,2001

5. Lead-free Solders in Microelectronics

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Sn – Zn – Ga alloys for leadfree soldering obtained by rapid quenching;Journal of the Belarusian State University. Physics;2020-06-04

2. Experimental and numerical study on dynamic mechanical behaviors of low-silver lead-free solder under combined compression-shear loadings;Journal of Materials Science: Materials in Electronics;2019-09-24

3. Kinetics of Ni solid-state dissolution in Sn and Sn3.5Ag alloys;Journal of Alloys and Compounds;2019-08

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