Pb-free solder—microstructural, material reliability, and failure relationships-Reference-Cited by-同舟云学术

Pb-free solder—microstructural, material reliability, and failure relationships

Published:2020 Issue: Volume: Page:107-151
ISSN:
Container-title:Handbook of Materials Failure Analysis
language:
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Author:

Ren Guang,Collins Maurice N.,Punch Jeff,Dalton Eric,Coyle Richard

Publisher

Elsevier

Reference95 articles.

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3. Lead-Free Solder Interconnect Reliability;Shangguan,2005

4. A review of mechanical properties of lead-free solders for electronic packaging;Ma;J. Mater. Sci.,2009

5. Advances in lead-free electronics soldering;Suganuma;Curr. Opin. Solid State Mater. Sci.,2001

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