Effects of Bi and Cu addition on mechanical properties of Sn9Zn alloy and interfacial intermetallic growth with Ni substrate-Reference-Cited by-同舟云学术

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Effects of Bi and Cu addition on mechanical properties of Sn9Zn alloy and interfacial intermetallic growth with Ni substrate

Published:2023-06 Issue: Volume:35 Page:106350
ISSN:2352-4928
Container-title:Materials Today Communications
language:en
Short-container-title:Materials Today Communications

Author:

Liu Haoyang,Wei Yuhang,Zhang Ye,Hou Zhuangzhuang,Zhao Xiuchen

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference43 articles.

1. Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys;Frear;Metall. Mater. Trans. A,1994

2. High-temperature lead-free solders: properties and possibilities;Suganuma;JOM J. Miner. Met. Mater. Soc.,2009

3. High-temperature lead-free solder alternatives;Chidambaram;Microelectron. Eng.,2011

4. Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys;Cheng;J. Mater. Sci.,2011

5. Structural, thermal and wetting characteristics of novel low Bi-Low Ag containing Sn--x. Ag--0.7 Cu--1.0 Bi (x= 0.5 to 1.5) alloys for electronic application;Kaushik;Met. Mater. Int.,2021

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of indium addition on mechanical, thermal, and soldering properties of eutectic Sn–9Zn alloy;Materials Chemistry and Physics;2024-03

2. Effect of Sn Addition on the Microstructure and Age-Hardening Response of a Zn-4Cu Alloy;Crystals;2023-11-25

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