Structural, Thermal and Wetting Characteristics of Novel Low Bi-Low Ag Containing Sn–x.Ag–0.7Cu–1.0Bi (x = 0.5 to 1.5) Alloys for Electronic Application-Reference-Cited by-同舟云学术

Structural, Thermal and Wetting Characteristics of Novel Low Bi-Low Ag Containing Sn–x.Ag–0.7Cu–1.0Bi (x = 0.5 to 1.5) Alloys for Electronic Application

Published:2020-09-28 Issue:11 Volume:27 Page:4550-4563
ISSN:1598-9623
Container-title:Metals and Materials International
language:en
Short-container-title:Met. Mater. Int.

Author:

Kaushik Raj Kumar^ORCID,Batra Uma,Sharma J. D.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

https://link.springer.com/content/pdf/10.1007/s12540-020-00880-w.pdf

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