Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition
Author:
Publisher
MDPI AG
Subject
General Materials Science
Link
http://www.mdpi.com/1996-1944/9/7/522/pdf
Reference39 articles.
1. Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
2. The bulk alloy microstructure and mechanical properties of Sn–1Ag–0.5Cu–xAl solders (x = 0, 0.1 and 0.2 wt. %)
3. Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys
4. The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints
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