Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys-Reference-Cited by-同舟云学术

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Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

Published:1994-07 Issue:7 Volume:25 Page:1509-1523
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:MMTA

Author:

Frear D. R.,Vianco P. T.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF02665483.pdf

Reference35 articles.

1. D. Unsworth and C. Mackay:Trans. Inst. Met. Finish., 1973, vol. 51, p. 85.

2. P. Kay and C. Mackay:Trans. Inst. Met. Finish., 1979, vol. 57, p. 169.

3. R. Klein-Wassink:Soldering in Electronics, Electrochem. Pub. Ltd., Ayr, Scotland, 1989.

4. L. Zakraysek:Welding J. Res. SuppL, 1972, Nov., p. 536-s.

5. A. Romig, R. Yost, and P. Hlava: Report No. SAND84-0575, Sandia National Laboratories, Albuquerque, NM, 1984.

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