Author:
Harrison M.R.,Vincent J.H.,Steen H.A.H.
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
Reference12 articles.
1. Effect of Natural Ageing on the Mechanical Properties of the Soldered Joint Used in the Electronics Industry
2. Evaluation of Lead- Free Solder Joints in Electronic Assemblies
3. Bulwith, R.A. and Mackay, C.A. (1995), “Silver scavenging inhibition of some silver loaded solders”,Welding Journal (Welding Research Supplement), March, pp. 86s‐90s.
4. Howes, M.A.H. and Saperstein, Z.P. (1969), “The reaction of lead‐tin solders with copper alloys”,Welding Journal (Research Supplement), February, pp. 80s‐85s.
5. Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys
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