Modifying of solder composition as MXT03 for high TC reliability on Cu-OSP by optimized elements in Sn-Ag-Cu-Ni-Bi system
Author:
Affiliation:
1. Gyeonggi-do,Korea,449-812
2. Sungkyunkwan University,Gyeonggi-do,Republic of Korea,440-746
Funder
Korea Evaluation Institute of Industrial Technology
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457609.pdf?arnumber=10457609
Reference9 articles.
1. Lead‐free reflow soldering for electronics assembly
2. Material characterization of a novel lead-free solder material — SACQ
3. Investigation on the melting and tensile properties of Bi-containing SAC105 lead-free solder alloys
4. Eeffect of Bi content on properties of low silver SAC solders;Maalekian;Simulation and Modeling Methodologies, Technologies and Applications (SMTA),2015
5. Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag 3 Sn particles during multiple reflows
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