Material characterization of a novel lead-free solder material — SACQ
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/6884273/6897249/06897333.pdf?arnumber=6897333
Cited by 28 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Finite element method and experimental study on life prediction of lead-free BGA solder joints using an energy-based approach;Journal of Materials Science: Materials in Electronics;2024-07
2. Influence of Nickel and Bismuth Addition on the Mechanical Shear Strength of SAC+ Ni, Bi Solders under Isothermal Aging and Multiple Reflows;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modeling;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
4. Modifying of solder composition as MXT03 for high TC reliability on Cu-OSP by optimized elements in Sn-Ag-Cu-Ni-Bi system;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
5. Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element Modeling;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
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