Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modeling
Author:
Affiliation:
1. Institute of Electronic Packaging Technology, Technische Universität,Dresden,Germany
2. GlobalFoundries,Dresden,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491281/10491408/10491475.pdf?arnumber=10491475
Reference24 articles.
1. Effects of Cu, Bi, and In on microstructure and tensile properties of Sn-Ag-X(Cu, Bi, In) solders
2. Effect of Bismuth Content on the Mechanical Cyclic Properties of SAC+Bi Lead Free Solders
3. Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder
4. Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing
5. Board Level Reliability Study of Next Generation Large Die Wafer Level Chip Scale Package Structures
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